Oki new thermal clamp nozzle for the rework of the stacked packaged devices

OK International AD603AR has introduced a precision rework tool for advanced packaging parts and assembly components - thermal clamp nozzle. New hot tongs nozzle can reduce the thermal stress, the stacked package (POP package) components imposed on the PCB during multiple rework operations than traditional hot air nozzle and the vacuum nozzle, new tools can significantly improve performance , coupled with the traditional tools are not suitable for multiple stacked together parts, the dome package chip, or easily damaged due to overheating, a small device. Stack welding point range, the thermal clamp nozzle enables the heat limitations, so they can prevent the entire PCB reaches the reflow temperature. But also a good alternative to the vacuum nozzle can be used to remove the dome package chips, or in repairing ball melt and produce a larger surface tension BGA package. The new thermal clamp MAX1473EUI nozzle can easily remove small components and connectors, especially those parts of the plastic shell. Repairing equipment (such as hot air tools) are easily damaged parts of the shell due to the Shi excessive heat or loss of control. Parts around often hot FT232RL wind off. PCB pads are usually in the manual disassembly with hand-held thermal clamp damage. On the contrary, the hot pliers nozzle to precisely control the heat, to welding and demolition parts at one go. OK Internationals thermal clamp Xizui work temperature of about 200 ℃, and the heating and combined from the demolition of components on the board action. Its jaws mounted on the reflow nozzle in the hot air heated to about 200 ℃, curved inwards, in order to grip the parts need to be removed. AD8369ARUZ Once the solder melts, the parts will be able to remove the heat clamp nozzle. Thermal clamp the nozzle design and rework equipment (heating nozzle OKi the APR-5000 Array Package Rework System) used in conjunction. Source: Electronic Engineering Times